■ Features and Benefits
Thermal conductivity: 2.5 W/m·K
Excellent thermal performance
Electrical insulating characteristics
Low oil-bleeding
High tack surface reduces contact resistance
Available in die-cut parts and sheets
Available with reinforcement carrier or non-reinforced one
Self-adhesive
■ Bornsun’s Thermal Pad (Gap pad)
Bornsun has been engaging in TIM material for more than 18 years. As a
leading manufacturer, we continually develop and manufacture gap-pad to
meet demands of clients. We're the only one manufacturer which is able
to produce 8W/m·k conductivity gap-pad in China.
BN-FS250 thermal pads, which are made from soft silicone conductive
materials, have excellent thermal and electrical insulating performance.
BN-FS250 thermal pad is soft and flexible which could reduce contact
resistance between heat generators and heat sinks, transferring heat to
heat spreaders effectively.
■ Application
Between an IC and a heat sink
Between a semiconductor and heat sink
Between power supply module and heat spreader
Between heat-generating devices and chassis
Hard drive cooling
Signal amplifier cooling
CD-ROM/DVD cooling
LEDs, lighting
Remark：Data above, which is based on lab
experiments, is reliable. However, the information given here shall in
no event be regarded as a guarantee of conditions or characteristics.
Tests must be done to make sure that the product is suitable for your
uses. For further information on technology, delivery terms and
conditions and prices, please feel free to contact us. We will always do
our best to help you.
