IC Chip Solutions
IC chips refer to all electronic components. Silicon board assembled
with a variety of electronic components is to realize its specific
function. It’s the profound part in electronic devices which running the
function of operation and storage. The application of integrated
circuits covers almost all of the electronic devices in the industry
military and civilian use.
Chipset is the core part of mother board. It generally splits in to
South Bridge and North Bridge according to their arrangement on
motherboard.
With rapidly changing microelectronic technology, chip is getting
smaller while its operation speed gets increased which results in
generating more heat. This leads to higher demands of head-spreading of
chips. Designers have to use advanced heat-spreading technology and
heat-spreading materials to take away heat, making sure that chips could
be functional in high working temperature.
Currently, using heat sink is a common way of heat-spreading (see
picture as below). Thermal materials are applied between heat sink and
chip, helping to dissipate heat quickly.
The gap between heat sink and chip which is a bad conductor affects the
cooling efficiency seriously. So the performance of heat sink is not as
good as expected, sometimes it even fail to function. In order to
reduce the gap and increase the contact surface, good thermal
performance thermal materials are required, such as thermal tapes,
thermal pads, thermal grease etc.
Heat which generated by chips are transferred to heat sink via thermal
material, and then the high speed rotating fan take out the heat to the
air (see picture as below).
Demands of thermal performance of thermal interface material increase along with the increasing integration of IC chips. Bornsun developed and manufactured professional TIMs for IC chips.
BN-FS800: thermal pad, high thermal conductivity—8W/m·K, high insulating performance, 1-3mm thickness.
BN-G600: thermal grease, high thermal conductivity—5.5W/m·K, easy to apply, no dry-out, solvent-free, long term reliability
BNK10 Sil-pad, thermal conductivity—1.3 W/m·K, 0.15mm thickness, low
thermal resistance, high insulating performance, breakdown voltage:5.5KV