导热硅脂
Thermal Pad

Features and Benefits

   Thermal conductivity: 2.0 W/m·K
   Excellent thermal performance
   Electrical insulating characteristics
   Low oil-bleeding
   High tack surface reduces contact resistance
   Available in die-cut parts and sheets
   Available with reinforcement carrier or non-reinforced one
   Self-adhesive 

 

Bornsun’s Thermal Pad (Gap pad)  

   Bornsun has been engaging in TIM material for more than 18 years. As a leading manufacturer, we continually develop and manufacture gap-pad to meet demands of clients. We're the only one manufacturer which is able to produce 8W/m·k conductivity gap-pad in China.
   BN-FS200 thermal pads, which are made from soft silicone conductive materials, have excellent thermal and electrical insulating performance.
   BN-FS200 thermal pad is soft and flexible which could reduce contact resistance between heat generators and heat sinks, transferring heat to heat spreaders effectively.

 

Application
   Between an IC and a heat sink
   Between a semiconductor and heat sink
   Between power supply module and heat spreader
   Between heat-generating devices and chassis
   Hard drive cooling
   Signal amplifier cooling
   CD-ROM/DVD cooling
   LEDs, lighting
 

 

Remark:Data above, which is based on lab experiments, is reliable. However, the information given here shall in no event be regarded as a guarantee of conditions or characteristics. Tests must be done to make sure that the product is suitable for your uses. For further information on technology, delivery terms and conditions and prices, please feel free to contact us. We will always do our best to help you.