■Features：
One component adhesive/sealant
Cures at room temperature when exposed to moisture in the air.
Alkoxy cure system,
Non-sag, paste consistency
Thermal conductivity: 0.8W/m·k
UL94 V-0
■RoHs Compliance: Yes
■Applications:
Sealing lids and housings
General sealing and component protection
Bonding hybrids or microprocessors to sinks
■Processing
All surfaces must be clean and dry. Degrease and wash off any
contaminants that could impair adhesion. Suitable solvents include
isopropyl alcohol, acetone or methyl ethyl ketone. Good unprimed
adhesion may be obtained on a variety of substrates, including enameled
and painted steel, aluminum, ceramics, glass and certain plastics.
Substrates to which good adhesion is normally not obtained include PTFE,
PE, PP and related materials. Apply a bead of BN-RT200 H Adhesive/
Sealant to one of the prepared surface, and then quickly cover with the
substrate to be bonded. Very deep sections, will take longer to cure
completely.
■Cure time
After skin formation， cure continues inward from the surface. Cure time
is extended at lower humidity levels. Before handling and packaging
bonded components, users are advised to wait a sufficiently long time to
ensure that the integrity of the adhesive seal is not affected. This
will depend on many factors and should be determined by the user for
each specific application.
■Packaging
100g/blister, 300ml cartridge.
■Usable life and storage
BN-RT200 H has a shelf life of 12 months from the date of manufacture
when stored at or below 30℃ in the original un opened containers.
