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Thermal silica pad applied to the role of electron..

日期：2018-12-12 14:13:33

With the rapid development of electronic technology,  "super human brain" computer products are essential electronic products  for people in the society. Thermal conductivity in the thermal  interface of a thermal conductivity of the product is thermal silica  pad, it is not only a high thermal conductivity of high-performance  thermal filler materials, or electronic products and thermal heat sink  chip or heat conduction between the role play a role, As a flexible  thermal conductive material, the thermal pad is widely used in the gap  filling between the heating element and the radiating element. In  addition to the function of heat transfer at the interface, the thermal  pad can also play the role of insulation, cushioning, absorption  tolerance and the like.

 

So, thermal conductivity of silicone gasket applied to the role of electronic products is what?

 

We all know that the most common problem with  electronic products is the problem of heat dissipation. Whether the heat  is good or not will directly affect the performance of electronic  products, and will even seriously damage the products. Because 3c  electronic products will have thermal management problems, many also  need to enhance the cooling of electronic components to achieve the  purpose of cooling, so the simple use of metal heatsink can not meet the  cooling function. When your product structure has space constraints  must be with thermal silica pad to make the overall cooling efficiency  will be more fully played. Thermal conductivity of the silicone gasket  not only has good thermal conductivity, but also the heat of electronic  components and heat sink pieces to effectively fill the gap between the  gap and enhance heat conduction.


Nowadays, with the advancement of science and  technology, the volume of electronic products is smaller, but the power  consumption of products is also getting larger and larger, and the  requirements for the entire heating group are even higher. In this case,  the materials used for the heat-conducting medium are more needed.

 Thermal silicone gasket

 

Thermal  silica gel gasket Application: generally located in the heat of the  chip or heat source, connecting the radiator or structural heat sink,  thermal silica pad material determines the good filling effect, the more  the use of a certain amount of compression can make the contact thermal  resistance Smaller, thermal conductivity will be better, thermal  conductivity silicone gasket is very easy to use, not easy to wear and  tear, easy to install thermal module, physical performance is stable,  not afraid of harsh environment of transport, so, thermal silica gasket  in electronic products Have a good application.


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