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Why electronic products to choose thermal insulation silicon film?

日期:2018-12-12 14:12:15
Why electronic products to choose thermal insulation silicon film?
 
Thermal conductivity materials used in a wide range of electronic products, the most common should be thermal insulation silicone gasket, it is a commonly used in electronic components on the thermal conductivity of materials. General electronic products are usually glass fiber substrate coated docile higher, containing silicone polymer made of plastic, a thermal adhesive material, then why a lot of electronic products to choose thermal insulation silicone film?
 
Thermal insulation silicone film as a substrate, add some metal oxides and other auxiliary materials, and thus through a special synthesis of a thermal conductivity of the dielectric material. Thermal insulation silicone film is designed for electronic products, the heat transfer gap and the design of thermal products, it filled the gap so that heat transfer between the site and the heat transfer parts, play insulation, damping, sealing and so on.
 
So why choose electronic products, thermal insulation silicone film it? The primary purpose of the first choice of thermal conductive silica film is to reduce the thermal contact resistance between the heat source surface and the contact surface of the heat sink. The thermal conductive silica film can well fill the gap of the contact surface. The second air is bad Hinder the heat transfer between the contact surface, the air is bad heat conductor will seriously hinder the heat transfer between the contact surface, and in the heat source and the radiator between the installation of thermal silica film can be out of the contact surface of air; Third, with the addition of thermal silica film, you can make the contact surface between the heat source and the radiator better and full contact, truly face-to-face contact, so that the temperature response can be as small as possible temperature difference.
 
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